Changing the calcination temperature to tune the microstructure and polishing properties of ceria octahedrons

被引:17
作者
Li, Yongxiu [1 ,2 ]
Wang, Xueliang [1 ]
Ding, Linmin [1 ]
Li, Yao [1 ]
He, Rucheng [1 ]
Li, Jing [1 ,2 ]
机构
[1] Nanchang Univ, Sch Chem & Chem Engn, Nanchang 330031, Jiangxi, Peoples R China
[2] Nanchang Univ, Inst Rare Earths, Nanchang 330031, Jiangxi, Peoples R China
基金
中国国家自然科学基金;
关键词
CHEMICAL-MECHANICAL PLANARIZATION; NANOSTRUCTURED CERIA; SILICON DIOXIDE; SURFACE; CEO2; XPS; CMP; NANOCRYSTALLINE; NANOPARTICLES; SUBSTRATE;
D O I
10.1039/d2ra02367a
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Ceria octahedrons with different microstructure and surface characteristics were prepared by calcining an octahedral CeO2 precursor self-assembled from spherical primary nanocrystals of about 5 nm at 500-900 degrees C. Structural characterization revealed that with the calcination temperature increasing from 500 to 700 degrees C, the products maintained a hierarchical structure and primary nanocrystals changed from spherical to octahedral particles. Significant fusion occurred between the primary nanocrystals and the surface of the octahedrons became smooth at the calcination temperature of 800 degrees C. Single crystal CeO2 octahedrons were formed when the calcination temperature reached 900 degrees C. The change in microstructure induced by elevated calcination temperature led to increased mechanical hardness and decreased surface chemical activity (specific surface area and surface Ce3+ concentration) of the octahedrons, which had an impact on their polishing performance. The polishing experiments on K9 glass showed that the polishing rate first increased and then decreased with the increment of calcination temperature, indicating that in addition to the mechanical hardness, the surface chemical activity of the octahedrons is also important for material removal. Owing to the best matching of chemical activity and mechanical hardness, CeO2 octahedrons calcinated at 700 degrees C exhibited the highest polishing rate and the best surface quality for K9 glass.
引用
收藏
页码:16554 / 16560
页数:7
相关论文
共 43 条
  • [41] Ceria concentration effect on chemical mechanical polishing of optical glass
    Wang, Liangyong
    Zhang, Kailiang
    Song, Zhitang
    Feng, Songlin
    [J]. APPLIED SURFACE SCIENCE, 2007, 253 (11) : 4951 - 4954
  • [42] Chemical effect on the material removal rate in the CMP of silicon wafers
    Wang, Y. G.
    Zhang, L. C.
    Biddut, A.
    [J]. WEAR, 2011, 270 (3-4) : 312 - 316
  • [43] A fundamental model proposed for material removal in chemical-mechanical polishing
    Xin, J.
    Cai, W.
    Tichy, J. A.
    [J]. WEAR, 2010, 268 (5-6) : 837 - 844