Determination of lattice parameters from multiple CBED patterns: A statistical approach

被引:9
作者
Brunetti, G. [1 ]
Bouzy, E. [1 ]
Fundenberger, J. J. [1 ]
Morawiec, A. [2 ]
Tidu, A. [1 ]
机构
[1] CNRS, UMR 7078, LETAM, F-57045 Metz 1, France
[2] Polish Acad Sci, Inst Met & Mat Sci, Krakow, Poland
关键词
CBED; Lattice parameters; Strain; Accuracy; Precision; Uncertainty; Error; Multiple patterns; Statistics; BEAM ELECTRON-DIFFRACTION; STRAIN-MEASUREMENTS; DEVICES; REFINEMENT; SILICON;
D O I
10.1016/j.ultramic.2009.11.004
中图分类号
TH742 [显微镜];
学科分类号
摘要
This study deals with the uncertainty of the measurement of lattice parameters by CBED using the kinematic approximation. The analysis of a large number of diffraction patterns acquired on a silicon sample at 93 K with a LaB6 TEM without energy filter shows the presence of both the systematic and the random parts of errors. It is established that random errors follow the normal statistical distribution and that the precision quantified by the relative standard deviation is about 3-4 x 10(-4) for lattice parameter measurements made from single pattern. The error sources are analyzed, different ways of enhancement are reviewed, and a new approach is proposed. It is shown that both accuracy and precision can be simply improved by taking into account multiple patterns analysis for the determination of the actual voltage, the single lattice parameter "a" or the complete set of lattice parameters. The precision of about 1.5-2 x 10(-4) can be reached using a minimum of three HOLZ line patterns for the single "a" parameter and about 5 x 10(-4) for the complete set of lattice parameters using six diffraction patterns. The use of multiple patterns also allows overcoming the non-uniqueness of solution linked to the CBED studies. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:269 / 277
页数:9
相关论文
共 32 条
  • [1] TEM/CBED determination of strain in silicon-based submicrometric electronic devices
    Armigliatoa, A
    Balboni, R
    Balboni, S
    Frabboni, S
    Tixier, A
    Carnevale, GP
    Colpani, P
    Pavia, G
    Marmiroli, A
    [J]. MICRON, 2000, 31 (03) : 203 - 209
  • [2] Improved precision in strain measurement using nanobeam electron diffraction
    Beche, A.
    Rouviere, J. L.
    Clement, L.
    Hartmann, J. M.
    [J]. APPLIED PHYSICS LETTERS, 2009, 95 (12)
  • [3] Strain measurements by convergent-beam electron diffraction:: The importance of stress relaxation in lamella preparations
    Clément, L
    Pantel, R
    Kwakman, LFT
    Rouvière, JL
    [J]. APPLIED PHYSICS LETTERS, 2004, 85 (04) : 651 - 653
  • [4] Cowley J.M., 1981, DIFFRACTION PHYS
  • [5] DETERMINATION OF STRUCTURE FACTORS, LATTICE STRAINS AND ACCELERATING VOLTAGE BY ENERGY-FILTERED CONVERGENT-BEAM ELECTRON-DIFFRACTION
    DEININGER, C
    NECKER, G
    MAYER, J
    [J]. ULTRAMICROSCOPY, 1994, 54 (01) : 15 - 30
  • [6] Polycrystal orientation maps from TEM
    Fundenberger, JJ
    Morawiec, A
    Bouzy, E
    Lecomte, JS
    [J]. ULTRAMICROSCOPY, 2003, 96 (02) : 127 - 137
  • [7] New approach for the dynamical simulation of CBED patterns in heavily strained specimens
    Houdellier, F.
    Altibelli, A.
    Roucau, C.
    Casanove, Mt
    [J]. ULTRAMICROSCOPY, 2008, 108 (05) : 426 - 432
  • [8] Effect of sample bending on diffracted intensities observed in CBED patterns of plan view strained samples
    Houdellier, F.
    Jacob, D.
    Casanove, M. J.
    Roucau, C.
    [J]. ULTRAMICROSCOPY, 2008, 108 (04) : 295 - 301
  • [9] Quantitative analysis of HOLZ line splitting in CBED patterns of epitaxially strained layers
    Houdellier, F.
    Roucau, C.
    Clement, L.
    Rouviere, J. L.
    Casanove, M. J.
    [J]. ULTRAMICROSCOPY, 2006, 106 (10) : 951 - 959
  • [10] Strain mapping of tensiley strained silicon transistors with embedded Si1-yCy source and drain by dark-field holography
    Huee, Florian
    Hytch, Martin
    Houdellier, Florent
    Bender, Hugo
    Claverie, Alain
    [J]. APPLIED PHYSICS LETTERS, 2009, 95 (07)