Microcreep of rapidly solidified Sn-0.7 wt.% Cu-In solder alloys

被引：18

作者：

Kamal, Mustafa

El-Ashram, Tarek ^{[1
]}

机构：

[1] Suez Canal Univ, Fac Educ, Dept Phys, Port Said 42111, Egypt

[2] Univ Mansoura, Fac Sci, Dept Phys, Mansoura, Egypt

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2007年 / 456卷 / 1-2期

关键词：

rapid solidification; X-ray diffraction; resistivity; Young's modulus; microhardness; microcreep;

D O I：

10.1016/j.msea.2007.01.056

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Sn-Cu eutectic alloy rapidly solidified has excellent mechanical and electrical properties, which makes it a suitable candidate for replacement of Pb-Sn solder, however it needs more study. In this paper, we study the effect of indium additions on the properties of Sn-Cu eutectic alloy. In addition, we use the new technique, which has been developed by [Tarek El-Ashram, R.M. Shalaby, J. Electron. Mater., 34 (2005) 212-215.] to study the creep behavior of Sn-Cu-In alloys. The results showed that the hardness of Sn-Cu eutectic alloy was increased due to the addition of indium, however, the creep resistance was decreased, also Young's modulus was decreased and the resistivity was increased. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：1 / 4

页数：4

共 9 条

[1] The relation between valency, axial ratio, Young's modulus and resistivity of rapidly solidified tin-based eutectic alloys [J].