On the adhesion performance of gradient-structured Ni-P metallic coatings

被引:21
|
作者
Lin, Yan [1 ,5 ]
Duan, Fenghui [2 ]
Pan, Jie [1 ,2 ,5 ]
Zhang, Cheng [1 ,5 ]
Chen, Qi [3 ]
Lu, Junyong [4 ]
Liu, Lin [1 ,5 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, Wuhan 430074, Peoples R China
[2] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
[3] Huazhong Univ Sci & Technol, Wuhan Natl High Magnet Field Ctr, Wuhan 430074, Peoples R China
[4] Naval Univ Engn, Natl Key Lab Sci & Technol Vessel Integrated Power, Wuhan 430033, Peoples R China
[5] Huazhong Univ Sci & Technol, State Key Lab Mat Proc & Die & Mould Technol, Wuhan 430074, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
Gradient structure; Ni-P coatings; Electrodeposition; Interface shear strength; Bending strength; MECHANICAL-PROPERTIES; WEAR-RESISTANCE; HARDNESS; ALLOYS; ELECTRODEPOSITION; MICROSTRUCTURE; PLASTICITY; DUCTILE; THICKNESS; CHROMIUM;
D O I
10.1016/j.msea.2022.143170
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Hard metallic coatings can provide exceptional protection for industrial settings; however, they usually have a uniform microstructure and suffer from poor adhesion with substrates because of stress/strain incompatibility induced by the sharp interface. Here, a gradient structure that transitions from coarse-grained Ni to nanocrystalline/amorphous Ni-P alloy has been designed to improve the adhesion performance of the electrodeposited Ni-P coatings. Based on two measures of adhesion performance, a high interface shear strength of -282.6 MPa and high bending strength of -868.4 MPa have been determined for the gradient-structured Ni-P coatings on the CuCrZr alloy substrate, which are increased, respectively, by -90% and -60% from those of the conventional monolithic-structured Ni-P coating. Post-mortem fractographic analysis reveals that introducing the gradient structure accommodates plastic deformation of the coating and provides exceptional crack arrest capability, contributing to the enhancement of adhesion performances under both shearing and bending. The present work not only reveals how the adhesion performance can be significantly improved in gradientstructured Ni-P coatings, but also provides a promising methodology for manufacturing novel GS metallic coatings with a combination of excellent surface functions and strong interface adhesion.
引用
收藏
页数:10
相关论文
共 50 条
  • [21] ELECTRODEPOSITION OF AMORPHOUS Ni-P ALLOY COATINGS
    Fang Zhaoheng Institute of Chemical Metallurgy
    Transactions of Nonferrous Metals Society of China, 1997, (03) : 149 - 152
  • [22] Electrodeposition of amorphous Ni-P alloy coatings
    Fang, ZH
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 1997, 7 (03) : 148 - 151
  • [23] Electrodeposition of Ni-P composite coatings: A review
    Lelevic, Aleksandra
    Walsh, Frank C.
    SURFACE & COATINGS TECHNOLOGY, 2019, 378
  • [24] Electrodeposition of Ni-P alloy coatings: A review
    Lelevic, Aleksandra
    Walsh, Frank C.
    SURFACE & COATINGS TECHNOLOGY, 2019, 369 : 198 - 220
  • [25] Tribological Performance of Pulse Electroplated Ni-P/BN(h) Composite Coatings
    Peng Cheng-zhang
    Zhu Ling-ling
    Tang Si-wen
    ADVANCES IN PRECISION INSTRUMENTATION AND MEASUREMENT, 2012, 103 : 504 - +
  • [27] REVIEW ON ELECTROLESS PLATING Ni-P COATINGS FOR IMPROVING SURFACE PERFORMANCE OF STEEL
    Zhang, Hongyan
    Zou, Jiaojuan
    Lin, Naiming
    Tang, Bin
    SURFACE REVIEW AND LETTERS, 2014, 21 (04)
  • [28] ANODIC BEHAVIOR OF NI-P AND NI-CR-P METALLIC GLASSES
    DIEGLE, RB
    CLAYTON, CR
    HELFAND, M
    SORENSEN, NR
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (8B) : C416 - C416
  • [29] Evaluation of the corrosion resistance of electroless Ni-P and Ni-P composite coatings by electrochemical impedance spectroscopy
    J. Balaraju
    T. Sankara Narayanan
    S. Seshadri
    Journal of Solid State Electrochemistry, 2001, 5 : 334 - 338
  • [30] Evaluation of the corrosion resistance of electroless Ni-P and Ni-P composite coatings by electrochemical impedance spectroscopy
    Balaraju, JN
    Narayanan, TSNS
    Seshadri, SK
    JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2001, 5 (05) : 334 - 338