Improved Electro-Thermal Model Incorporating Device Aging Effect Towards Accurate Temperature Tracking in Electric Motor Drives

被引：1

作者：

Kundu, Animesh ^{[1
]}

Korta, Philip ^{[1
]}

Balamurali, Aiswarya ^{[1
]}

Iyer, Lakshmi, V ^{[2
]}

Kar, Narayan C. ^{[1
]}

机构：

[1] Univ Windsor, Elect & Comp Engn, Windsor, ON, Canada

[2] Magna Int Inc, Corp Engn & R&D, Troy, MI USA

来源：

2021 24TH INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES AND SYSTEMS (ICEMS 2021) | 2021年

关键词：

Aging; characterization; electro-thermal model; loss model; lifetime estimation; thermal model; JUNCTION TEMPERATURE; IGBT; MODULES;

D O I：

10.23919/ICEMS52562.2021.9634576

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Accurate electro-thermal models are imperative for device junction temperature determination. Existing research focuses on electro-thermal model development based on the device V-I characteristics in a healthy condition; however, it is important to observe the change in device characteristics in a degraded state as well to accommodate the change in temperature sensitive parameters such as collector-emitter voltage, resistance, and energy dissipation. Therefore, this paper develops an advanced electro-thermal model incorporating device aging effects. Initially, the device loss model is developed considering temperature sensitive electrical parameters. Subsequently, towards accurate junction temperature estimation, a novel thermal network model considering the thermal expansion due to device aging is derived. The proposed methodology is validated using a 100 kW inverter.

引用

页码：1037 / 1042

页数：6

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