Demonstration of a micro-CPL based on MEMS fabrication technologies

被引:0
作者
Kirshberg, J [1 ]
Yerkes, KL [1 ]
Liepmann, D [1 ]
机构
[1] Univ Calif Berkeley, Dept Engn Mech, Berkeley, CA 94720 USA
来源
35TH INTERSOCIETY ENERGY CONVERSION ENGINEERING CONFERENCE & EXHIBIT (IECEC), VOLS 1 AND 2, TECHNICAL PAPERS | 2000年
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中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
Utilizing current Micro Electro Mechanical Systems (MEMS) technologies, a three-port microcapillary pumped loop (micro-CPL) was designed, fabricated and tested to provide integral cooling to electronics or MEMS type devices. The two wafer design consists of one silicon and one borofloat glass wafer. An analytical study was used in determining the geometry of the device, including the evaporator dimensions (1000 mu m x 2000 mu m) and the length of the liquid and vapor lines (35 mm). Using laser spot heating, the finished device was run near steady-state, it was determined that a laser delivering 8.5 W (+/- 0.2 W) with a spot-size diameter of 3.5mm caused dry-out of the micro-CPL.
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页码:1198 / 1204
页数:7
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