A transregional CMOS SRAM with single, LogicVDD and dynamic power rails

被引:28
作者
Bhavnagarwala, AJ [1 ]
Kosonocky, SV [1 ]
Kowalczyk, SP [1 ]
Joshi, RV [1 ]
Chan, YH [1 ]
Srinivasan, U [1 ]
Wadhwa, JK [1 ]
机构
[1] IBM Corp, Syst Grp, Poughkeepsie, NY USA
来源
2004 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS | 2004年
关键词
D O I
10.1109/VLSIC.2004.1346591
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
New circuit techniques are reported that enable a single V-DD SRAM to operate at logic compatible voltages with a cell read current and cell static noise margin (SNM) typically seen with higher/dual VDD SRAMs. Implemented in a 65nm CMOS SOI process with no alterations to the CMOS process or to a conventional, single V-T SRAM cell, the voltage across power rails of the selected SRAM cells self-biases to permit a higher-than-V-DD voltage during WL active periods and a lower than 2V(T) voltage at all other times. Bootstrapping the cell row power supply and regulating the cell subarray virtual ground voltage enables the above 'Transregional' SRAM operation resulting in near-subthreshold data storage and superthreshold access, lowering total leakage by over 10X and improving I-READ and SNM by 7% and 18% respectively with a total area overhead of less than 13%.
引用
收藏
页码:292 / 293
页数:2
相关论文
共 15 条
  • [1] BHAVNAGARWALA A, 2003, IEEE S VLSI CKTS JUN, P251
  • [2] The impact of intrinsic device fluctuations on CMOS SRAM cell stability
    Bhavnagarwala, AJ
    Tang, XH
    Meindl, JD
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2001, 36 (04) : 658 - 665
  • [3] FRANK DJ, 1999, S VLSI TECHN, P169
  • [4] Noise margin and leakage in ultra-low leakage SRAM cell design
    Hook, TB
    Breitwisch, M
    Brown, J
    Cottrell, P
    Hoyniak, D
    Lam, C
    Mann, R
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2002, 49 (08) : 1499 - 1501
  • [5] A deep sub-V, single power-supply SRAM cell with multi-VT, boosted storage node and dynamic load
    Itoh, K
    Fridi, AR
    Bellaouar, A
    Elmasry, MI
    [J]. 1996 SYMPOSIUM ON VLSI CIRCUITS - DIGEST OF TECHNICAL PAPERS, 1996, : 132 - 133
  • [6] SUBTHRESHOLD CURRENT REDUCTION FOR DECODED-DRIVER BY SELF-REVERSE BIASING
    KAWAHARA, T
    HORIGUCHI, M
    KAWAJIRI, Y
    KITSUKAWA, G
    KURE, T
    AOKI, M
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1993, 28 (11) : 1136 - 1144
  • [7] WORST-CASE STATIC NOISE MARGIN CRITERIA FOR LOGIC-CIRCUITS AND THEIR MATHEMATICAL EQUIVALENCE
    LOHSTROH, J
    SEEVINCK, E
    DEGROOT, J
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1983, 18 (06) : 803 - 807
  • [8] Ultralow-power SRAM technology
    Mann, RW
    Abadeer, WW
    Breitwisch, MJ
    Bula, O
    Brown, JS
    Colwill, BC
    Cottrell, PE
    Crocco, WG
    Furkay, SS
    Hauser, MJ
    Hook, TB
    Hoyniak, D
    Johnson, JM
    Lam, CH
    Mih, RD
    Rivard, J
    Moriwaki, A
    Phipps, E
    Putnam, CS
    Rainey, BA
    Toomey, JJ
    Younus, MI
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2003, 47 (5-6) : 553 - 566
  • [9] Accurate modeling of transistor stacks to effectively reduce total standby leakage in nano-scale CMOS circuits
    Mukhopadhyay, S
    Roy, K
    [J]. 2003 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2003, : 53 - 56
  • [10] Review and future prospects of low-voltage RAM circuits
    Nakagome, Y
    Horiguchi, M
    Kawahara, T
    Itoh, K
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2003, 47 (5-6) : 525 - 552