The effects of triple junctions and grain boundaries on hardness and Young's modulus in nanostructured Ni-P

被引：139
作者：
Zhou, Y
Erb, U
Aust, KT
Palumbo, G
机构：
[1] Univ Toronto, Dept Mat Sci & Engn, Toronto, ON M5S 3E4, Canada
[2] Integran Technol Inc, Toronto, ON M9W 4Z6, Canada
来源：
SCRIPTA MATERIALIA | 2003年 / 48卷 / 06期
基金：
加拿大自然科学与工程研究理事会;
关键词：
interfaces; mechanical properties; nanoindentation; nanocrystalline materials; electroplating;
D O I：
10.1016/S1359-6462(02)00511-0
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Hardness and Young's modulus were measured on a series of nanocrystalline Ni-P samples. With decreasing grain size, a transition from regular to inverse Hall-Petch relationship and. a reduction in Young's modulus at the smallest grain sizes was observed, which can be attributed to grain boundary and triple junction effect. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：825 / 830
页数：6
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