Inverse heat conduction problem in a phase change memory device

被引：2

作者：

Battaglia, Jean-Luc ^{[1
]}

De, Indrayush ^{[1
]}

Sousa, Veronique ^{[2
]}

机构：

[1] Univ Bordeaux, CNRS, UMR 5295, Lab I2M, 351 Cours Liberat, F-33405 Talence, France

[2] CEA, LETI, MINATEC, 17 Rue Martyrs, F-38054 Grenoble 9, France

来源：

EUROTHERM SEMINAR NO 108 - NANOSCALE AND MICROSCALE HEAT TRANSFER V | 2017年 / 785卷

关键词：

D O I：

10.1088/1742-6596/785/1/012002

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

An invers heat conduction problem is solved considering the thermal investigation of a phase change memory device using the scanning thermal microscopy. The heat transfer model rests on system identification for the probe thermal impedance and on a finite element method for the device thermal impedance. Unknown parameters in the model are then identified using a nonlinear least square algorithm that minimizes the quadratic gap between the measured probe temperature and the simulated one.

引用

页数：6

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