Comparative study of thermal cycling and thermal shocks tests on electronic components reliability

被引：13

作者：

Moreau, S

Lequeu, T

Jérisian, R

机构：

[1] LMP, F-37071 Tours 2, France

[2] STMicroelectronics, F-37071 Tours, France

来源：

MICROELECTRONICS RELIABILITY | 2004年 / 44卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2004.07.027

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, the first reliability results of Thermal Cycling Tests (TCT, air-air test) and Thermal Shock Tests (TST, liquid-liquid test) on medium power electronic components are discussed. The influence of dwell times, extremes temperatures and mean temperature is investigated. This study is based on statistical data correlated with information coming from failure analysis and confirmed by a basic FEM analysis. (C) 2004 Elsevier Ltd. All rights reserved.

引用

页码：1343 / 1347

页数：5