Bonding techniques for hybrid active pixel sensors (HAPS)

被引：24

作者：

Bigas, M. ^{[1
]}

Cabruja, E. ^{[1
]}

Lozano, M. ^{[1
]}

机构：

[1] CSIC, CNM IMB, Ctr Nacl Microelect, Barcelona 08193, Spain

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2007年 / 574卷 / 02期

关键词：

flip chip; bumping; 2D packaging; 3D packaging; solder bumps; hybrid active pixel sensors (HAPS);

D O I：

10.1016/j.nima.2007.01.176

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

A hybrid active pixel sensor (HAPS) consists of an array of sensing elements which is connected to an electronic read-out unit. The most used way to connect these two different devices is bump bonding. This interconnection technique is very suitable for these systems because it allows a very fine pitch and a high number of I/Os. However, there are other interconnection techniques available such as direct bonding. This paper, as a continuation of a review [M. Lozano, E. Cabruja, A. Collado, J. Santander, M. Ullan, Nucl. Instr. and Meth. A 473 (1-2) (2001) 95-101] published in 2001, presents an update of the different advanced bonding techniques available for manufacturing a hybrid active pixel detector. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：392 / 400

页数：9

共 38 条

[1] The DELPHI very forward tracker for LEP200 [J].

Andreazza, A ;

Aubret, C ;

Baubillier, M ;

Becks, KH ;

Bosio, C ;

Botner, O ;

Boutonnet, C ;

Brunet, JM ;

Bystrom, O ;

Caccia, M ;

Chochula, P ;

Cindro, V ;

Clemens, JC ;

CohenSolal, M ;

Delpierre, P ;

Drees, J ;

Dufour, Y ;

Ekelof, T ;

Gerlach, P ;

Glitza, KW ;

Guglielmi, L ;

Hallgren, A ;

Hanuska, E ;

Heuser, J ;

Jaeger, JJ ;

Janik, R ;

Jeraj, R ;

Kersten, S ;

Kind, P ;

Krammer, M ;

Kurchaninov, L ;

Leder, G ;

Ledroit, F ;

Leitner, R ;

Liko, D ;

Lindqvist, LE ;

Lokajicek, M ;

Lopez, L ;

Macek, S ;

Maier, A ;

Margan, E ;

Mariotti, C ;

Masik, J ;

Meroni, C ;

Monig, K ;

Mouthuy, T ;

Pernegger, H ;

Pernicka, M ;

Pindo, M ;

Rakoczy, D .

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 1995, 367 (1-3) :198-201

[2]

ANTINORI F, 1995, NUCL INSTRUM METH A, V360, P314

[3] Hybrid pixel detector development for the linear collider vertex detector [J].

Battaglia, M ;

Borghi, S ;

Caccia, M ;

Campagnolo, R ;

Kucewicz, W ;

Palka, H ;

Zalewska, A .

IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2001, 48 (04) :992-996

[4]

Bauer CE, 2002, EL PACKAG TECH CONF, P276, DOI 10.1109/EPTC.2002.1185682

[5] Building pixel detector modules in multichip module deposited technology [J].

Becks, KH ;

Flick, T ;

Grah, C ;

Gerlach, P ;

Mättig, P .

IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2005, 52 (06) :3176-3180

[6] A MCM-D-type module for the ATLAS pixel detector [J].

Becks, KH ;

Beyne, E ;

Ehrmann, O ;

Gerlach, P ;

Gregor, IM ;

Pieters, P ;

Töpper, M ;

Truzzi, C ;

Wolf, J .

IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 1999, 46 (06) :1861-1864

[7] Review of CMOS image sensors [J].

Bigas, M ;

Cabruja, E ;

Forest, J ;

Salvi, J .

MICROELECTRONICS JOURNAL, 2006, 37 (05) :433-451

[8] High density of electrodeposited Sn/Ag bumps for flip chip connection [J].

Bigas, M ;

Cabruja, E .

MICROELECTRONIC ENGINEERING, 2006, 83 (03) :399-403

[9] Characterisation of electroplated Sn/Ag solder bumps [J].

Bigas, M ;

Cabruja, E .

MICROELECTRONICS JOURNAL, 2006, 37 (04) :308-316

[10]

Bisogni MG, 2004, IEEE NUCL SCI CONF R, P4524

← 1 2 3 4 →