Mechanistic modeling study on process optimization and precursor utilization with atmospheric spatial atomic layer deposition

被引:19
作者
Deng, Zhang [1 ]
He, Wenjie [1 ]
Duan, Chenlong [1 ]
Chen, Rong [2 ]
Shan, Bin [3 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China
[2] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Sch Opt & Elect Informat, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China
[3] Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, State Key Lab Mat Proc & Die & Mould Technol, Wuhan 430074, Hubei, Peoples R China
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 2016年 / 34卷 / 01期
基金
中国国家自然科学基金;
关键词
ALUMINUM; PRESSURE;
D O I
10.1116/1.4932564
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Spatial atomic layer deposition (SALD) is a promising technology with the aim of combining the advantages of excellent uniformity and conformity of temporal atomic layer deposition (ALD), and an industrial scalable and continuous process. In this manuscript, an experimental and numerical combined model of atmospheric SALD system is presented. To establish the connection between the process parameters and the growth efficiency, a quantitative model on reactant isolation, throughput, and precursor utilization is performed based on the separation gas flow rate, carrier gas flow rate, and precursor mass fraction. The simulation results based on this model show an inverse relation between the precursor usage and the carrier gas flow rate. With the constant carrier gas flow, the relationship of precursor usage and precursor mass fraction follows monotonic function. The precursor concentration, regardless of gas velocity, is the determinant factor of the minimal residual time. The narrow gap between precursor injecting heads and the substrate surface in general SALD system leads to a low Peclet number. In this situation, the gas diffusion act as a leading role in the precursor transport in the small gap rather than the convection. Fluid kinetics from the numerical model is independent of the specific structure, which is instructive for the SALD geometry design as well as its process optimization. (C) 2015 American Vacuum Society.
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页数:8
相关论文
共 33 条
[1]   Low temperature temporal and spatial atomic layer deposition of TiO2 films [J].
Aghaee, Morteza ;
Maydannik, Philipp S. ;
Johansson, Petri ;
Kuusipalo, Jurkka ;
Creatore, Mariadriana ;
Homola, Tomas ;
Cameron, David C. .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2015, 33 (04)
[2]   High rate roll-to-roll atmospheric atomic layer deposition of Al2O3 thin films towards gas diffusion barriers on polymers [J].
Ali, Kamran ;
Choi, Kyung-Hyun ;
Jo, Jeongdai ;
Lee, Yun Woo .
MATERIALS LETTERS, 2014, 136 :90-94
[3]   High rate roll to roll atomic layer deposition, and its application to moisture barriers on polymer films [J].
Dickey, Eric ;
Barrow, William A. .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2012, 30 (02)
[4]   Evaluating operating conditions for continuous atmospheric atomic layer deposition using a multiple slit gas source head [J].
Fitzpatrick, P. Ryan ;
Gibbs, Zachary M. ;
George, Steven M. .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2012, 30 (01)
[5]   Atomic Layer Deposition: An Overview [J].
George, Steven M. .
CHEMICAL REVIEWS, 2010, 110 (01) :111-131
[6]   Batch ALD: Characteristics, comparison with single wafer ALD, and examples [J].
Granneman, Ernst ;
Fischer, Pamela ;
Pierreux, Dieter ;
Terhorst, Herbert ;
Zagwijn, Peter .
SURFACE & COATINGS TECHNOLOGY, 2007, 201 (22-23) :8899-8907
[7]   Spatial Atmospheric Atomic Layer Deposition of AlxZn1-xO [J].
Illiberi, A. ;
Scherpenborg, R. ;
Wu, Y. ;
Roozeboom, F. ;
Poodt, P. .
ACS APPLIED MATERIALS & INTERFACES, 2013, 5 (24) :13124-13128
[8]   Atomic Layer Deposition of Al2O3 and ZnO at Atmospheric Pressure in a Flow Tube Reactor [J].
Jur, Jesse S. ;
Parsons, Gregory N. .
ACS APPLIED MATERIALS & INTERFACES, 2011, 3 (02) :299-308
[9]   Advanced process technologies: Plasma, direct-write, atmospheric pressure, and roll-to-roll ALD [J].
Kessels, W. M. M. ;
Putkonen, Matti .
MRS BULLETIN, 2011, 36 (11) :907-913
[10]   High Throughput Atomic Layer Deposition for Encapsulation of Large Area Electronics [J].
Kools, J. C. S. .
ATOMIC LAYER DEPOSITION APPLICATIONS 7, 2011, 41 (02) :195-201