Fabrication of multilayer microstructures using dry film resist and deep reactive ion etcher

被引：8

作者：

Aljada, M. ^{[1
]}

Asthana, A. ^{[1
]}

机构：

[1] Univ Queensland, Australian Inst Bioengn & Nanotechnol, Australian Natl Fabricat Facil Qld Node, St Lucia, Qld 4067, Australia

来源：

MICRO & NANO LETTERS | 2010年 / 5卷 / 02期

关键词：

CAPILLARY-ELECTROPHORESIS; MICROFABRICATION; LITHOGRAPHY; PHOTORESIST; TECHNOLOGY; CHIPS;

D O I：

10.1049/mnl.2010.0019

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this Letter, the authors demonstrate fabrication of multilevel microstructures using inductively coupled plasma deep reactive ion etcher (ICP-DRIE) in conjunction with dry film photoresist (DFR) as etch mask. By limiting the usage of photoresist on the layers, both the chances of introducing contamination as well as wastage of photoresist are reduced. Thus, combining DFR with DRIE in microfabricating of multilevel microstructure has the potential to significantly reduce fabrication time, cost and contamination.

引用

页码：121 / 124

页数：4

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