Introduction to the Special Issue on the 2019 IEEE International Solid-State Circuits Conference (ISSCC)

被引：0

作者：

Carusone, Tony Chan ^{[1
]}

Seok, Mingoo ^{[2
]}

Chang, Hsie-Chia ^{[3
]}

Chang, Meng-Fan ^{[4
]}

机构：

[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada

[2] Columbia Univ, Dept Elect Engn, New York, NY 10027 USA

[3] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 30010, Taiwan

[4] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 300, Taiwan

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2020年 / 55卷 / 01期

关键词：

D O I：

10.1109/JSSC.2019.2953371

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This Special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2019 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 17-21, 2019, in San Francisco, CA, USA. This Special Issue covers articles from the Wireline, Digital Circuits, Digital Architectures and Systems (DASs), and Memory Committees. © 1966-2012 IEEE.

引用

页码：3 / 5

页数：3