Diamond composites of high thermal conductivity and low dielectric loss tangent

被引：8
作者：
Osipov, A. S. [1 ]
Klimczyk, P. [2 ]
Rutkowski, P. [3 ]
Melniychuk, Y. A. [1 ]
Romanko, L. O. [1 ]
Podsiadlo, M. [2 ]
Petrusha, I. A. [1 ]
Jaworska, L. [3 ]
机构：
[1] Natl Acad Sci Ukraine, Inst Superhard Mat, 2 Avtozavodskya St, UA-04074 Kiev, Ukraine
[2] Krakow Inst Technol, Lukasiewicz Res Network, Zakopianska 73, PL-30418 Krakow, Poland
[3] AGH Univ Sci & Technol, 30 Al Mickiewicza, PL-30059 Krakow, Poland
来源：
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2021年 / 269卷
关键词：
Diamond composite; High pressure; Thermal conductivity; Dielectric constant; Dielectric loss tangent; CVD DIAMOND; PRESSURE;
D O I：
10.1016/j.mseb.2021.115171
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Diamond-CaMg(CO3)(2) and diamond-CaCO3 compacts were produced. Maximum values of high thermal conductivity of 540 W/m K, electrical resistivity of 2.10(11) ohm cm, dielectric constant of 47, and dielectric loss tangent of 5.8.10(-3) at 106 Hz were achieved. The composites based on diamonds were sintered at a high pressure of 8.0 GPa and temperature of 2100 degrees C and were characterised by high ratios of direct bonding between the diamond grains. Diamond grain size varied from 12 to 45 mu m. The CaCO3 content of the diamond-CaCO3 composites and the CaMg(CO3)(2) content of the diamond-CaMg(CO3) (2) composites were 8.5 vol% and 8.8 vol%, respectively. The materials developed are recommended for use as heat sinks in a wide range of electronic devices.
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页数：5
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