Fabrication of multipurpose AFM/SCM/SEP microprobe with integrated piezoresistive deflection sensor and isolated conductive tip

被引：10

作者：

Gotszalk, T

Grabiec, P

Shi, F

Dumania, P

Hudek, P

Rangelow, IW

机构：

[1] Wroclaw Tech Univ, Inst Electron Technol, PL-50372 Wroclaw, Poland

[2] Univ Gesamthsch Kassel, Inst Tech Phys, D-34109 Kassel, Germany

[3] Slovak Acad Sci, Inst Comp Syst, SK-84237 Bratislava, Slovakia

来源：

MICROELECTRONIC ENGINEERING | 1998年 / 42卷

关键词：

D O I：

10.1016/S0167-9317(98)00111-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Scanning microprobe with multipurpose capabilities is presented. Atomic Force Microscopy (AFM), Scanning Capacitance Microscopy (SCM) and Scanning Electrostatic Probing (SEP) measurements could be simultaneously performed with the silicon tip integrated with piezoresistive cantilever. Manufacturing process of the microprobe. based on double side bulk\surface micromachining of SOI substrates, is described. Presented results of measurements of the nearfield forces with nanometer resolution revealed that surface topography of the samples together with its electronic properties could be scanned. This makes our microprobe useful e.g. for surface analysis of submicron IC's.

引用

页码：477 / 480

页数：4