3-D Printed Bandpass Filter Using Conical Posts Interlaced Vertically

被引:0
作者
Lopez-Oliver, Enrique [1 ]
Tomassoni, Cristiano [1 ]
Silvestri, Lorenzo [2 ]
Bozzi, Maurizio [2 ]
Perregrini, Luca [2 ]
Marconi, Stefania [3 ]
Alaimo, Gianluca [3 ]
Auricchio, Ferdinando [3 ]
机构
[1] Univ Perugia, DIEI, Perugia, Italy
[2] Univ Pavia, Dept Elect Comp & Biomed Engn, Pavia, Italy
[3] Univ Pavia, Dept Civil Engn & Architecture, Pavia, Italy
来源
PROCEEDINGS OF THE 2020 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2020年
基金
欧盟地平线“2020”;
关键词
Additive manufacturing; 3D printing; bandpass filter; conical resonator; combline filter;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new class of filters using conical post resonators is presented. The proposed structure consists of stacked rectangular cavities where each cavity has a capacitive conical resonating post positioned in its center. The resonator is very similar to that used in combline filters, but in this case, taking advantage of the stacked arrangement and of the conical shape, each post has its upper part partially inserted in the hollow base of the post above it. The resulting structure is more compact than the classical combline filter, whereas the Q -factor is very similar. In order to validate the proposed structure, a doublet filter prototype has been designed, manufactured using additive manufacturing techniques and tested.
引用
收藏
页码:580 / 582
页数:3
相关论文
共 50 条
  • [1] 3-D-Printed Compact Bandpass Filters Based on Conical Posts
    Lopez-Oliver, Enrique
    Tomassoni, Cristiano
    Silvestri, Lorenzo
    Bozzi, Maurizio
    Perregrini, Luca
    Marconi, Stefania
    Alaimo, Gianluca
    Auricchio, Ferdinando
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2021, 69 (01) : 616 - 628
  • [2] 3-D Printed Bandpass Filters With Coupled Vertically Extruded Split Ring Resonators
    Vallecchi, Andrea
    Cadman, Darren
    Whittow, William G.
    Vardaxoglou, John
    Shamonina, Ekaterina
    Stevens, Christopher J.
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2019, 67 (11) : 4341 - 4352
  • [3] A Monolithic Stereolithography 3-D Printed Ka-Band Spherical Resonator Bandpass Filter
    Li, Yu
    Li, Jin
    Zhang, Meng
    Wang, Hongbo
    Xu, Jun
    Xiao, Shaoqiu
    2018 IEEE RADIO & WIRELESS SYMPOSIUM (RWS), 2018, : 56 - 59
  • [4] 3-D Metal Printed Inline Quasi-Elliptic Bandpass Filter
    Rao, Jiayu
    Nai, Kenneth
    Hong, Jiasheng
    2020 50TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2020, : 894 - 896
  • [5] Bandpass Filter Based on 3-D-Printed Ceramic Resonators
    Lopez-Oliver, Enrique
    Tomassoni, Cristiano
    Cacciamani, Fabrizio
    Pelliccia, Luca
    di Crestvolant, Vittorio Tornielli
    2022 24TH INTERNATIONAL MICROWAVE AND RADAR CONFERENCE (MIKON), 2022,
  • [6] Compact High-Q Hemispherical Resonators for 3-D Printed Bandpass Filter Applications
    Li, Jin
    Guo, Cheng
    Mao, Lijian
    Xu, Jun
    2017 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2017, : 1591 - 1594
  • [7] 3-D Printed Slotted Spherical Resonator Bandpass Filters With Spurious Suppression
    Zhang, Fan
    Gao, Sufang
    Li, Jin
    Yu, Yang
    Guo, Cheng
    Li, Sheng
    Attallah, Moataz
    Shang, Xiaobang
    Wang, Yi
    Lancaster, Michael J.
    Xu, Jun
    IEEE ACCESS, 2019, 7 : 128026 - 128034
  • [8] A 3-D Printed Bandpass Filter Using TM211-Mode Slotted Spherical Resonators With Enhanced Spurious Suppression
    Zhang, Fan
    Guo, Cheng
    Zhang, Yi
    Gao, Yang
    Liu, Bing
    Shu, Minjie
    Wang, Yi
    Dong, Yuliang
    Lancaster, Michael J.
    Xu, Jun
    IEEE ACCESS, 2020, 8 : 213215 - 213223
  • [9] Miniaturized Monolithic 3-D Printed Bandpass Filters Using Nested Spherical Resonators
    Liu, Jiawei
    Zhao, Kunchen
    Psychogiou, Dimitra
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2023, 13 (09): : 1461 - 1470
  • [10] 3-D Printed Filter Based On Helical Resonators With Variable Width
    Shang, Xiaobang
    Li, Jin
    Guo, Cheng
    Lancaster, Michael J.
    Xu, Jun
    2017 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2017, : 1587 - 1590