Improving the adhesion of electroless-nickel coating layer on diamond powder

被引：46

作者：

Ahn, J. G.

Kim, D. J.

Lee, J. R.

Chung, H. S.

Kim, C. O.

Hai, H. T.

机构：

[1] Korean Inst Geosci & Mineral Resource, Mineral & Mat Proc Div, Taejon 305350, South Korea

[2] Chungnam Natl Univ, Dept Mat Sci & Engn, Taejon 305764, South Korea

来源：

SURFACE & COATINGS TECHNOLOGY | 2006年 / 201卷 / 06期

关键词：

surface characterization; coating; adhesion; nickel-diamond composite;

D O I：

10.1016/j.surfcoat.2006.05.029

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

An electroless-nickel plating method with semi-batch reactor was employed to coat diamond powders. Ni-P fines are known to be a main cause for generating pore structure in the nickel coating layer was eliminated by lowering the rate of reduction by means of temperature, pH and feeding rate of reductant. It was found that at a temperature of 70 degrees C, pH of 4.8, feeding rate of reductant of 0.25 ml/min the Ni-P fines were entirely eliminated, resulting in a rapid improvement of diamond-coated nickel layer adhesion. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：3793 / 3796

页数：4

共 22 条

[1]

AUDRAND D, 1995, MET FINISH SEP, P55

[2] NICKEL PLATING ON STEEL BY CHEMICAL REDUCTION [J].