4H-SiC photoconductive switching devices for use in high-power applications

被引:93
|
作者
Dogan, S
Teke, A
Huang, D
Morkoç, H
Roberts, CB
Parish, J
Ganguly, B
Smith, M
Myers, RE
Saddow, SE
机构
[1] Virginia Commonwealth Univ, Dept Elect Engn, Richmond, VA 23284 USA
[2] Ltd Liabil Corp, Tech Explore, Oxford, OH 45056 USA
[3] USAF, Res Lab, Wright Patterson AFB, OH 45433 USA
[4] Elect Engn Univ S Florida, Tampa, FL 33543 USA
[5] Ataturk Univ, Fac Arts & Sci, Dept Phys, TR-25240 Erzurum, Turkey
[6] Balikesir Univ, Fac Arts & Sci, Dept Phys, TR-10100 Balikesir, Turkey
关键词
D O I
10.1063/1.1571667
中图分类号
O59 [应用物理学];
学科分类号
摘要
Silicon carbide is a wide-band-gap semiconductor suitable for high-power high-voltage devices and it has excellent properties for use in photoconductive semiconductor switches (PCSSs). PCSS were fabricated as planar structures on high-resistivity 4H-SiC and tested at dc bias voltages up to 1000 V. The typical maximum photocurrent of the device at 1000 V was about 49.4 A. The average on-state resistance and the ratio of on-state to off-state currents were about 20 Omega and 3x10(11), respectively. Photoconductivity pulse widths for all applied voltages were 8-10 ns. These excellent results are due in part to the removal of the surface damage by high-temperature H-2 etching and surface preparation. Atomic force microscopy images revealed that very good surface morphology, atomic layer flatness, and large step width were achieved. (C) 2003 American Institute of Physics.
引用
收藏
页码:3107 / 3109
页数:3
相关论文
共 50 条
  • [31] A novel 4H-SiC MOSFET for low switching loss and high-reliability applications
    Han, Zhonglin
    Song, Guan
    Bai, Yun
    Chen, Hong
    Liu, Xinyu
    Lu, Jiang
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2020, 35 (08)
  • [32] High quality uniform thick epitaxy of 4H-SiC for high power device applications
    Zhang, Jie
    Mazzola, Janice
    Romano, Esteban
    Hoff, Carl
    Mazzola, Mike
    Casady, Janna
    Casady, Jeff
    SILICON CARBIDE 2006 - MATERIALS, PROCESSING AND DEVICES, 2006, 911 : 107 - +
  • [33] Evaluation of 4H-SiC DMOSFETs for power converter applications
    Green, Ronald
    Urciuoli, Damian
    Ogumiiyi, Aderinto
    Koebke, Gail
    Everhart, Lauren
    Ibiayoa, Dimeji
    Lelis, Aivars
    Hull, Brett
    2007 INTERNATIONAL SEMICONDUCTOR DEVICE RESEARCH SYMPOSIUM, VOLS 1 AND 2, 2007, : 312 - +
  • [34] A novel 4H-SiC MESFET with serpentine channel for high power and high frequency applications
    Jia, Hujun
    Luo, Yehui
    Zhang, Hang
    Xing, Ding
    Ma, Peimiao
    SUPERLATTICES AND MICROSTRUCTURES, 2017, 101 : 315 - 322
  • [35] 4H-SiC Metalens: Mitigating Thermal Drift Effect in High-Power Laser Irradiation
    Chen, Boqu
    Sun, Xiaoyu
    Li, Xiaoxuan
    Cai, Lu
    Zhao, Ding
    Du, Kaikai
    Pan, Meiyan
    Qiu, Min
    ADVANCED MATERIALS, 2025, 37 (03)
  • [36] Advances in 4H-SiC homoepitaxy for production and development of power devices
    Thomas, Bernd
    Hecht, Christian
    Stein, Rene
    Friedrichs, Peter
    SILICON CARBIDE 2006 - MATERIALS, PROCESSING AND DEVICES, 2006, 911 : 37 - +
  • [37] Radio-frequency heating of GaAs and SiC photoconductive switch for high-power applications
    Gunda, Rahul
    Gleason, David S.
    Kelkar, Kapil
    Kirawanich, Phumin
    Nunnally, William C.
    Islam, Naz E.
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2006, 34 (05) : 1697 - 1701
  • [38] Modeling of High Voltage 4H-SiC JFETs and MOSFETs for Power Electronics Applications
    Wang, Yi
    Cass, Callaway
    Tang, Ke
    Naik, Harsh
    Chow, T. Paul
    Boroyevich, Dushan
    Wang, Fred
    2008 IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-10, 2008, : 4758 - +
  • [39] 4H-SiC pn diode grown by LPE method for high power applications
    Kuznetsov, N
    Bauman, D
    Gavrilin, A
    Kassamakova, L
    Kakanakov, R
    Sarov, G
    Cholakova, T
    Zekentes, K
    Dmitriev, V
    SILICON CARBIDE AND RELATED MATERIALS - 2002, 2002, 433-4 : 867 - 870
  • [40] Physical modeling and scaling properties of 4H-SiC power devices
    Hatakeyama, T
    Nishio, J
    Ota, C
    Shinohe, T
    SISPAD: 2005 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, 2005, : 171 - 174