A REVIEW OF SCHEDULING THEORY AND METHODS FOR SEMICONDUCTOR MANUFACTURING CLUSTER TOOLS

被引:105
作者
Lee, Tae-Eog [1 ]
机构
[1] Korea Adv Inst Sci & Technol, Dept Ind & Syst Engn, Yusung Gu, Deajeon, South Korea
来源
2008 WINTER SIMULATION CONFERENCE, VOLS 1-5 | 2008年
关键词
D O I
10.1109/WSC.2008.4736310
中图分类号
TP31 [计算机软件];
学科分类号
081202 ; 0835 ;
摘要
Cluster tools, which combine several single-wafer processing modules with wafer handling robots in a closed environment, have been increasingly used for most wafer fabrication processes. We review tool architectures, operational issues, and scheduling requirements. We then explain recent progress in tool science and engineering for scheduling and control of cluster tools.
引用
收藏
页码:2127 / 2135
页数:9
相关论文
共 43 条
[1]  
CALVEZ S, 1997, P IFAC CIS 97 C CONT, P495
[2]   Cyclic scheduling of a hoist with time window constraints [J].
Chen, HX ;
Chu, CB ;
Proth, JM .
IEEE TRANSACTIONS ON ROBOTICS AND AUTOMATION, 1998, 14 (01) :144-152
[3]   Multicluster tools scheduling: An integrated event graph and network model approach [J].
Ding, Shengwei ;
Yi, Jingang ;
Zhang, Mike Tao .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2006, 19 (03) :339-351
[4]  
JUNG C, 2006, THESIS KAIST DAEJON
[5]   Efficient Scheduling Method Based On An Assignment Model For Robotized Cluster Tools [J].
Jung, Chihyun ;
Lee, Tae-Eog .
2008 IEEE INTERNATIONAL CONFERENCE ON AUTOMATION SCIENCE AND ENGINEERING, VOLS 1 AND 2, 2008, :79-84
[6]  
KIM HJ, 2006, THESIS KAIST DAEJON
[7]  
Kim J. J., 2002, Proceedings of the 7th World Congress on Genetics Applied to Livestock Production, Montpellier, France, August, 2002. Session 21, P1
[8]   Schedulability analysis of time-constrained cluster tools with bounded time variation by an extended Petri net [J].
Kim, Ja-Hee ;
Lee, Tae-Eog .
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, 2008, 5 (03) :490-503
[9]  
Kim JH, 2003, IEEE INT CONF ROBOT, P1039
[10]   Scheduling analysis of time-constrained dual-armed cluster tools [J].
Kim, JH ;
Lee, TE ;
Lee, HY ;
Park, DB .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2003, 16 (03) :521-534