Thermal conductivity of AlN/PE composite substrate

被引：0

作者：

Wang, YD ^{[1
]}

Zhou, HP ^{[1
]}

Qiao, L ^{[1
]}

Chen, H ^{[1
]}

Jin, HB ^{[1
]}

机构：

[1] Tsing Hua Univ, Dept Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China

来源：

JOURNAL OF INORGANIC MATERIALS | 2000年 / 15卷 / 06期

关键词：

aluminum nitride; thermal conductivity; composite substrate;

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

AlN/PE composite substrate was made by mould Dressing. The influences of AlN percentage and morphology on the thermal conductivity were studied and the model for predicting thermal conductivity was discussed. The results demonstrate that with the increasing of AIN percentage, the thermal conductivity remains the same initially, after that it increases sharply, and then the rate slows down. The AlN whisker increases the thermal conductivity most efficiently, the second is that AlN fiber and AlN powder are of less efficiency.

引用

页码：1030 / 1036

页数：7

共 5 条

[1]

AFARI Y, 1993, J APPL POLYM SCI, V49, P1625

[2] CERAMIC-FIBER POLYMER COMPOSITES FOR ELECTRONIC SUBSTRATES [J].