Pb-free solder-alloy based on Sn-Zn-Bi with the addition of germanium

被引：45

作者：

Wang, Shuo-Hong ^{[2
]}

Chin, Tsung-Shune ^{[1
,2
]}

Yang, Ching-Feng ^{[3
]}

Chen, Sinn-Wen ^{[3
]}

Chuang, Chin-Tzuan ^{[4
]}

机构：

[1] Feng Chia Univ, Dept Mat Sci & Engn, Taichung 40724, Taiwan

[2] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu 30013, Taiwan

[3] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 30013, Taiwan

[4] Ind Technol Res Inst, Mat & Chem Lab, Chutung 31040, Hsinchu County, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2010年 / 497卷 / 1-2期

关键词：

Pb-free solder; Ge addition; Coefficient of thermal expansion; Electrical resistivity; Tensile strength; LEAD-FREE SOLDER; INTERFACIAL REACTIONS; MECHANICAL-PROPERTIES; MICROSTRUCTURAL EVOLUTION; TENSILE PROPERTIES; EUTECTIC ALLOY; CU SOLDER; AG; JOINTS; MICROHARDNESS;

D O I：

10.1016/j.jallcom.2010.03.094

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

We investigated the effect of Ge additions (0.1-0.5 at.%) on properties of Sn(84)Zn(13)Bi(3) solder-alloys, specifically the anti-oxidation capability, electrical resistance, thermal expansion behavior, and mechanical strength The Sn-Zn-Bi-Ge alloys have a melting point around 197 C, and are not noticeably oxidized after soaking at 250 degrees C for 180 min under ambient air flow 100 ml/min Coefficient of thermal expansion, tunable between 10 and 17 ppm/degrees C by the Ge addition, matches those of various metals such as Cu, Ni or lead-frames, leading to low thermal stress. Electrical resistivity of Sn-Zn-Bi-Ge solder-alloys, 10-15 mu Omega cm, is much lower than that of Sn-37Pb solder The micro-Vickers hardness, up to 400 MPa with 0 5 at.% Ge addition, is 150% that of Ge-free Sn(84)Zn(13)Bi(3), or 300% that of Sn-37Pb solder. Moreover, it possesses better tensile strength, being 127% that of Ge-free Sn(84)Zn(13)Bi(3), and 190% that of Sn-37Pb solder. (C) 2010 Elsevier B V All rights reserved

引用

页码：428 / 431

页数：4

共 30 条

[11] Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder [J].

Islam, MN ;

Chan, YC ;

Rizvi, MJ ;

Jillek, W .

JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 400 (1-2) :136-144

[12] Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging [J].

Islam, MN ;

Sharif, A ;

Chan, YC .

JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (02) :143-149

[13] Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints [J].

Kim, KS ;

Huh, SH ;

Suganuma, K .

JOURNAL OF ALLOYS AND COMPOUNDS, 2003, 352 (1-2) :226-236

[14] Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys [J].

Kim, YS ;

Kim, KS ;

Hwang, CW ;

Suganuma, K .

JOURNAL OF ALLOYS AND COMPOUNDS, 2003, 352 (1-2) :237-245

[15] Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment [J].

Lalena, JN ;

Dean, NF ;

Weiser, MW .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) :1244-1249

[16] Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn-Zn eutectic alloy [J].

Lee, Jae-Ean ;

Kim, Keun-Soo ;

Inoue, Masahiro ;

Jiang, Junxiang ;

Suganuma, Katsuaki .

JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 454 (1-2) :310-320

[17] Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate [J].

Liou, Wei-kai ;

Yen, Yee-wen ;

Chen, Kuen-da .

JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 479 (1-2) :225-229

[18]

MASSALSKI TB, 1992, GE SN PHASE DIAGRAM, P2004

[19] NEW PB-FREE SOLDER ALLOY WITH SUPERIOR MECHANICAL-PROPERTIES [J].

MCCORMACK, M ;

JIN, S ;

KAMMLOTT, GW ;

CHEN, HS .

APPLIED PHYSICS LETTERS, 1993, 63 (01) :15-17

[20] NEW LEAD-FREE, SN-AG-ZN-CU SOLDER ALLOY WITH IMPROVED MECHANICAL-PROPERTIES [J].

MCCORMACK, M ;

KAMMLOTT, GW ;

CHEN, HS ;

JIN, S .

APPLIED PHYSICS LETTERS, 1994, 65 (10) :1233-1235

← 1 2 3 →