Pb-free solder-alloy based on Sn-Zn-Bi with the addition of germanium

被引：45
作者：
Wang, Shuo-Hong [2 ]
Chin, Tsung-Shune [1 ,2 ]
Yang, Ching-Feng [3 ]
Chen, Sinn-Wen [3 ]
Chuang, Chin-Tzuan [4 ]
机构：
[1] Feng Chia Univ, Dept Mat Sci & Engn, Taichung 40724, Taiwan
[2] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu 30013, Taiwan
[3] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 30013, Taiwan
[4] Ind Technol Res Inst, Mat & Chem Lab, Chutung 31040, Hsinchu County, Taiwan
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2010年 / 497卷 / 1-2期
关键词：
Pb-free solder; Ge addition; Coefficient of thermal expansion; Electrical resistivity; Tensile strength; LEAD-FREE SOLDER; INTERFACIAL REACTIONS; MECHANICAL-PROPERTIES; MICROSTRUCTURAL EVOLUTION; TENSILE PROPERTIES; EUTECTIC ALLOY; CU SOLDER; AG; JOINTS; MICROHARDNESS;
D O I：
10.1016/j.jallcom.2010.03.094
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
We investigated the effect of Ge additions (0.1-0.5 at.%) on properties of Sn(84)Zn(13)Bi(3) solder-alloys, specifically the anti-oxidation capability, electrical resistance, thermal expansion behavior, and mechanical strength The Sn-Zn-Bi-Ge alloys have a melting point around 197 C, and are not noticeably oxidized after soaking at 250 degrees C for 180 min under ambient air flow 100 ml/min Coefficient of thermal expansion, tunable between 10 and 17 ppm/degrees C by the Ge addition, matches those of various metals such as Cu, Ni or lead-frames, leading to low thermal stress. Electrical resistivity of Sn-Zn-Bi-Ge solder-alloys, 10-15 mu Omega cm, is much lower than that of Sn-37Pb solder The micro-Vickers hardness, up to 400 MPa with 0 5 at.% Ge addition, is 150% that of Ge-free Sn(84)Zn(13)Bi(3), or 300% that of Sn-37Pb solder. Moreover, it possesses better tensile strength, being 127% that of Ge-free Sn(84)Zn(13)Bi(3), and 190% that of Sn-37Pb solder. (C) 2010 Elsevier B V All rights reserved
引用
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页码：428 / 431
页数：4
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