Textural profile analysis of sunflower-sesame kernel confection (chikki)

被引:9
作者
Gupta, R. K. [1 ]
Sharma, A. [1 ]
机构
[1] Cent Inst Postharvest Engn & Technol, Food Grains & Oilseeds Proc Div, Ludhiana 141004, Punjab, India
关键词
confection (chikki); response surface methodology; sesame kernel; sunflower kernel; textural profile analysis;
D O I
10.1111/j.1745-4603.2007.00091.x
中图分类号
TS2 [食品工业];
学科分类号
0832 ;
摘要
Models capable of predicting textural quality of sunflower-sesame kernel confection (chikki) have been developed using response surface methodology. The model can be used to determine the effect of sunflower-sesame kernel proportions on texture profile analysis (TPA) parameters of the product. The quality attributes measured were hardness, cohesiveness, springiness, chewiness and resilience, whose values varied from 100-183 N, 1.01-2.82, 1.00-1.18, 21.7-495.1 N and 0.297-0.436, respectively. The highest values of hardness, chewiness and resilience were attained for the snacks prepared using jaggery (brown sugar) : sunflower kernel : sesame kernel in the ratio of 50:35:25. The highest values of cohesiveness and springiness were observed with 50:25:15 (jaggery : sunflower : sesame) proportions. The sensory term overall acceptability of the snacks is significantly correlated with instrumental cohesiveness, springiness and chewiness, which are the desired quality attributes of the snacks.
引用
收藏
页码:153 / 165
页数:13
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