Simulation approach of atomic layer deposition in large 3D structures

被引:9
作者
Schwille, Matthias C. [1 ]
Barth, Jonas [1 ]
Schoessler, Timo [1 ]
Schoen, Florian [1 ]
Bartha, Johann W. [2 ]
Oettel, Martin [3 ]
机构
[1] Robert Bosch GmbH, D-72762 Reutlingen, Germany
[2] Tech Univ Dresden, Dept Elect Engn & Informat Technol, IHM, D-01062 Dresden, Germany
[3] Tuebingen Univ, Inst Appl Phys, D-72076 Tubingen, Germany
关键词
thin films; atomic layer deposition; growth simulation; TUBES; MODEL;
D O I
10.1088/1361-651X/aa5f9d
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We present a new simulation method predicting thicknesses of thin films obtained by atomic layer deposition in high aspect ratio 3D geometries as they appear in MEMS manufacturing. The method features a Monte-Carlo computation of film deposition in free molecular flow, as well as in the Knudsen and diffusive gas regime, applicable for large structures. We compare our approach to analytic and simulation results from the literature. The capability of the method is demonstrated by a comparison to experimental film thicknesses in a large 3D structure. Finally, the feasability to extract process parameters, i.e. sticking coefficients is shown.
引用
收藏
页数:18
相关论文
共 17 条
  • [1] A Ballistic Transport and Surface Reaction Model for Simulating Atomic Layer Deposition Processes in High-Aspect-Ratio Nanopores
    Adomaitis, Raymond A.
    [J]. CHEMICAL VAPOR DEPOSITION, 2011, 17 (10-12) : 353 - 365
  • [2] [Anonymous], 2002, HDB PHYS
  • [3] Cosine law at the atomic scale: Toward realistic simulations of Knudsen diffusion
    Celestini, Franck
    Mortessagne, Fabrice
    [J]. PHYSICAL REVIEW E, 2008, 77 (02):
  • [4] Chapman S, 1970, MATH THEORY NONUNIFO, P80
  • [5] Modeling the Conformality of Atomic Layer Deposition: The Effect of Sticking Probability
    Dendooven, J.
    Deduytsche, D.
    Musschoot, J.
    Vanmeirhaeghe, R. L.
    Detavernier, C.
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156 (04) : P63 - P67
  • [6] Gluch R, 2010, P EMRS 2009 SPRING M, V518, P4553
  • [7] Comparison between Monte Carlo and analytical calculation of the conductance of cylindrical and conical tubes
    Gómez-Goñi, J
    Lobo, PJ
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (04): : 1452 - 1457
  • [8] A kinetic model for step coverage by atomic layer deposition in narrow holes or trenches
    Gordon, RG
    Hausmann, D
    Kim, E
    Shepard, J
    [J]. CHEMICAL VAPOR DEPOSITION, 2003, 9 (02) : 73 - 78
  • [9] Modeling precursor diffusion and reaction of atomic layer deposition in porous structures
    Keuter, Thomas
    Menzler, Norbert Heribert
    Mauer, Georg
    Vondahlen, Frank
    Vassen, Robert
    Buchkremer, Hans Peter
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2015, 33 (01):
  • [10] Step coverage modeling of thin films in atomic layer deposition
    Kim, Ja-Yong
    Ahn, Ji-Hoon
    Kang, Sang-Won
    Kim, Jin-Hyock
    [J]. JOURNAL OF APPLIED PHYSICS, 2007, 101 (07)