共 20 条
[1]
Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2001, 24 (03)
:510-519
[3]
Ko JH, 2003, IEEE MTT-S, P2281, DOI 10.1109/MWSYM.2003.1210621
[4]
Characterization of Fully Embedded RF Inductors in Organic SOP Technology
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2009, 32 (02)
:491-496
[5]
Design and analysis of embedded inductor on low cost multilayer laminate MCM technology
[J].
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING,
2003,
:83-86
[6]
LTCC Spiral Inductor Synthesis and Optimization With Measurement Verification
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2010, 33 (01)
:160-168
[7]
Characterization of a planar spiral inductor on a composite-resin low-impedance substrate and its application to microwave circuits
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1998, 21 (03)
:269-273
[9]
Robertson I.D., 2001, RFIC MMIC DESIGN TEC