Interface properties of copper/aluminum/stainless steel clad materials

被引：19

作者：

Bae, Dong-Su ^{[1
]}

Kim, Soon-Kook ^{[1
]}

Lee, Sang-Pill ^{[2
]}

Shibayama, Tamaki ^{[3
]}

Bae, Dong-Hyun ^{[4
]}

机构：

[1] Dong Eui Univ, Dept Adv Mat Engn, Pusan, South Korea

[2] Dong Eui Univ, Dept Mech Engn, Busan, South Korea

[3] Hokkaido Univ, CAREM, Sapporo, Hokkaido 0608628, Japan

[4] Korea Clod Tech Co, Busan 618287, South Korea

来源：

MECHANICAL BEHAVIOR OF MATERIALS X, PTS 1AND 2 | 2007年 / 345-346卷

关键词：

copper/aluminum/stainless steel clad material; rolling; interface; bonding strength; intermetallic compound; diffusion bonding; copper oxide;

D O I：

10.4028/www.scientific.net/KEM.345-346.1497

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and heat treatment process. These specimens were evaluated the formability and bonding strength of Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film formed on copper surface during heat treatment at 673K similar to 773K. Diffusion bonding was observed at the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about 10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nano-sized crevice in reacted region of Al/STS interfaces.

引用

页码：1497 / +

页数：2

共 7 条

[1] Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process [J].