Influence of shear strength on long term biased humidity reliability of Cu ball bonds

被引:9
作者
Gan, C. L. [1 ]
Hashim, U. [1 ]
机构
[1] Univ Malaysia Perlis, INEE, Kangar 01000, Perlis, Malaysia
关键词
COPPER WIRE; GOLD;
D O I
10.1007/s10854-014-2234-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper compares and discusses the influence of shear strength (in terms of shear-per mils-square) of Au and Cu ball bonds on the biased humidity reliability performance in SOIC 8LD leaded package. Biased (HAST) highly accelerated temperature and humidity stress test, 130 degrees C, 85 % RH) has been carried out to estimate the long term reliability of Au and Cu ball bonds. Lognormal reliability plots have been plotted for the three legs (control, leg 1 and leg 2) whereby Shear-per-mil-square of 6.68 is identified to have better mean-time-to-failure (t(50)) compared to other two legs. Open failure from biased HAST 96, 192 h are subjected for secondary electron microscopy cross-sectioning and found typical interfacial CuAl intermetallic compound corrosion microcracking. HAST failure rates have been analyzed and the Cu ball bond lifetime has been established by using Peck model. The obtained Cu ball bond lifetime, of SPMS of 6.68 is >25 years and belongs to wearout reliability data point. This proves significant influence of SPMS on biased HAST failure rate. The higher the ball bond shear strength the lower the failure rate of biased HAST test. Hence, we should implement control on the average SPMS of >= 7.50 g/mil(2).
引用
收藏
页码:4786 / 4792
页数:7
相关论文
共 26 条
[1]  
[Anonymous], PLOS ONE
[2]  
[Anonymous], 2014, COPPER WIRE BONDING, DOI DOI 10.1007/978-1-4614-5761-9
[3]  
[Anonymous], 2010, 2010 34 IEEE CPMT IN
[4]  
[Anonymous], 2013, J NANOMATER, DOI DOI 10.1155/2013/486373
[5]   Shear Strength and Failure Modes of As-Bonded Gold and Copper Ball Bonds on Aluminum Metallization [J].
Breach, C. D. ;
Lee, T. K. .
JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (07) :2018-2028
[6]   Copper Wire Bonding Concerns and Best Practices [J].
Chauhan, Preeti ;
Zhong, Z. W. ;
Pecht, Michael .
JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (08) :2415-2434
[7]   Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging [J].
Gan, C. L. ;
Classe, F. C. ;
Chan, B. L. ;
Hashim, U. .
JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (04) :1017-1025
[8]   Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging [J].
Gan, C. L. ;
Hashim, U. .
JOURNAL OF ELECTRONIC PACKAGING, 2013, 135 (02)
[9]   Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package [J].
Gan, C. L. ;
Hashim, U. .
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (08) :2803-2811
[10]   Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging [J].
Gan, C. L. ;
Ng, E. K. ;
Chan, B. L. ;
Hashim, U. ;
Classe, F. C. .
JOURNAL OF NANOMATERIALS, 2012, 2012