A 3D Circuit Model for Power Distribution Networks in Complex Package Structures

被引：0

作者：

Zhou, Zhi Guo ^{[1
]}

Huang, Xiao Jia ^{[1
]}

Tong, Mei Song ^{[1
]}

机构：

[1] Tongji Univ, Dept Elect Sci & Technol, Shanghai, Peoples R China

来源：

2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM | 2016年

基金：

中国国家自然科学基金;

关键词：

Power Distribution Networks; Circuit Models; Inductance Extraction;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We propose a three dimensional circuit model that is used for characterizing big power nets in complex flip chip packages. The model is based on block division of a multilayered package. Besides, the model breaks the package into three parts along the z-dimension according to layer stackups. The model parameters can be evaluated individually and thus rapidly by using commercial software. The model is easy to maintain and update by reassigning power grid.

引用

页码：99 / 101

页数：3