Development of low-cost hot embossing stamps with long life span and environmental protection

被引：10
作者：
Kuo, Chil-Chyuan [1 ]
Lyu, Shin-Yun [1 ]
机构：
[1] Ming Chi Univ Technol, Dept Mech Engn, 84 Gungjuan Rd, New Taipei 243, Taiwan
来源：
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2017年 / 91卷 / 5-8期
关键词：
Hot embossing; Stamp; Fracture location; Simulation; VIBRATION; LASER;
D O I：
10.1007/s00170-016-9953-x
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Time, cost, and life span are three major concerns that are needed to manufacture a new hot embossing stamp in the industry. The aim of this study is to develop a rapid and low-cost method for fabricating new hot embossing stamps with a long life span. Based on the results of ANSYS simulations, the maximum stresses can be reduced when the round and chamfer were applied at the junction of groove and sprue in the backing plate. Experimental results found that the fracture locations were found to be in reasonable agreement with the simulation results using ANSYS software. The hot embossing stamp can be used for batch production and evaluation in the research and development stage of a new optical element when the junction of groove and sprue in the backing plate were rounded with a radius more than 2 mm or chamfered with a width more than 3 mm.
引用
收藏
页码：1889 / 1895
页数：7
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