Wire formation on circuit boards using spatially coupled bipolar electrochemistry

被引：32

作者：

Bradley, JC

Crawford, J

Ernazarova, K

McGee, M

Stephens, SG

机构：

[1] Drexel University, Department of Chemistry, Philadelphia, PA 19104

来源：

ADVANCED MATERIALS | 1997年 / 9卷 / 15期

关键词：

D O I：

10.1002/adma.19970091509

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

The creation of electrical contacts between selected copper rings on a commercial circuit board by a novel method is reported. The method relies on spatially coupled electrodissolution and electrodeposition mediated by an electric field, followed by electroless deposition. The Figure shows an example of a conductive wire formed between two circular rings after the electroless plating step-see also the cover of this issue.

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页码：1168 / &

页数：5

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