Use of dielectric spectroscopy to assess adhesively bonded composite structures, part II: Dielectric study

被引:4
|
作者
Pethrick, RA
Boinard, P
Banks, WM
机构
[1] Univ Strathclyde, Dept Mech Engn, Glasgow G1 1XJ, Lanark, Scotland
[2] Univ Strathclyde, Dept Pure & Appl Chem, Glasgow G1 1XJ, Lanark, Scotland
来源
JOURNAL OF ADHESION | 2002年 / 78卷 / 12期
关键词
bonded structures; composite structures; joints; adhesive; moisture; dielectric spectroscopy;
D O I
10.1080/00218460215042
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
A study, of the sorption and desorption of moisture in a structural adhesively bonded composite structure using low- and high-frequency, dielectric spectroscopy is reported when the adhesive is subjected to a hot and wet environment. As water penetrates the structure, variations in the dielectric permittivity and dielectric loss can be used to understand the nature of the absorption process. A new dielectric tool is introduced to aid interpretation of the dielectric data based on the Kirkwood-Frohlich equation of the dipolar activity. The data are correlated with gravimetric and dynamic mechanical thermal analysis of the adhesive during exposure to moisture reported in Part I of this series of three articles.
引用
收藏
页码:1015 / +
页数:13
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