Design and Fabrication of a Dielectricless Substrate-Integrated Waveguide

被引：35

作者：

Bigelli, Francesco ^{[1
]}

Mencarelli, Davide ^{[2
]}

Farina, Marco ^{[3
]}

Venanzoni, Giuseppe ^{[5
]}

Scalmati, Paolo ^{[1
]}

Renghini, Chiara ^{[1
]}

Morini, Antonio ^{[4
]}

机构：

[1] Somacis SPA, I-60022 Castelfidardo, Italy

[2] Univ Politecn Marche, Dept Informat Engn, I-60131 Ancona, Italy

[3] Univ Politecn Marche, Electromagnet, I-60131 Ancona, Italy

[4] Univ Politecn Marche, Appl Electromagnet, I-60131 Ancona, Italy

[5] Univ Politecn Marche, Electromagnetism Microwaves, I-60131 Ancona, Italy

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2016年 / 6卷 / 02期

关键词：

Buried waveguide; low-loss substrate-integrated waveguide (SIW); printed-circuit board (PCB) waveguide; waveguide;

D O I：

10.1109/TCPMT.2015.2513077

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A process for the fabrication of dielectricless rectangular waveguides (RWGs) integrated in the substrate is presented and experimentally validated. First, two complementary circuits are realized through milling the guide in a substrate and, then, are metallized with traditional additive processes used in printed-circuit board industry. Next, the circuits are joined together, and electric continuity is enforced through two additional rows of conductive holes along the guide sidewall, as it occurs in the substrate-integrated waveguide technology. A comparison between the propagative characteristics of a classic RWG and a waveguide with this methodology is reported. Finally, a slotted waveguide realized by this technology is fabricated and measured.

引用

页码：256 / 261

页数：6

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