3d integration for introspection

被引：2
|
作者：
Mysore, Shashidhar [1 ]
Agrawal, Banit [1 ]
Srivastava, Navin [1 ]
Lin, Sheng-Chih [1 ]
Banerjee, Kaustav [1 ]
Sherwood, Timothy [1 ]
机构：
[1] Univ Calif Santa Barbara, Dept Comp Sci, Santa Barbara, CA 93106 USA
来源：
IEEE MICRO | 2007年 / 27卷 / 01期
关键词：
D O I：
10.1109/MM.2007.1
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
In today's complex processors, specialized profiling and introspection hardware would be incredibly beneficial to software developers, but most proposals for its addition would increase the cost of every die manufactured. Modular, "snap-on'' analysis hardware, stacked vertically with the processor die using a 3D interconnect, could be included with developer systems to assist in debugging and testing, and omitted from consumer systems to keep them economically competitive.
引用
收藏
页码：77 / 83
页数：7
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