3d integration for introspection

被引：2

作者：

Mysore, Shashidhar ^{[1
]}

Agrawal, Banit ^{[1
]}

Srivastava, Navin ^{[1
]}

Lin, Sheng-Chih ^{[1
]}

Banerjee, Kaustav ^{[1
]}

Sherwood, Timothy ^{[1
]}

机构：

[1] Univ Calif Santa Barbara, Dept Comp Sci, Santa Barbara, CA 93106 USA

来源：

IEEE MICRO | 2007年 / 27卷 / 01期

关键词：

D O I：

10.1109/MM.2007.1

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In today's complex processors, specialized profiling and introspection hardware would be incredibly beneficial to software developers, but most proposals for its addition would increase the cost of every die manufactured. Modular, "snap-on'' analysis hardware, stacked vertically with the processor die using a 3D interconnect, could be included with developer systems to assist in debugging and testing, and omitted from consumer systems to keep them economically competitive.

引用

页码：77 / 83

页数：7

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