Low Cycle Fatigue Behavior of SnAgCu Solder Joints

被引：0

作者：

Wang Chao ^{[1
]}

Zhu Yongxin ^{[1
]}

Li Xiaoyan ^{[1
]}

Gao Ruiting ^{[1
]}

机构：

[1] Beijing Univ Technol, Beijing 100124, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2016年 / 45卷 / 04期

关键词：

low cycle fatigue; lead-free solder joint; reliability; crack initiation; crack propagation; CU; MICROSTRUCTURE; IMC; BI;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Low cycle mechanical fatigue tests on 96.5Sn-3Ag-0.5Cu lead-free solder joints were carried out using a micro-uniaxial fatigue testing system at 25 degrees C with different frequencies (1 similar to 10 Hz) and a wide range of strain (2%similar to 8%). The results show that the low cycle fatigue (LCF) life of the solder joint follows the Coffin-Manson equation in different strain ranges. Frequency-modified Coffin-Manson equation can describe the frequency effect on the fatigue life of lead-free solder joints. The analysis of failure process show that the fatigue cracks initiate at the interfaces between the solder and inter-metallic compound (MC) around the edge of the joints, and then propagate within the solder along the solder/MC interfaces proximately. Fracture morphologies of solder joints under different frequencies mainly consist of an initiated region, a propagation region and a final fracture region. The fracture mechanism of the final fracture region transforms from inter-granular fracture to trans-granular fracture with increasing of frequency.

引用

页码：828 / 834

页数：7

共 17 条

[11] Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength [J].