Low Cycle Fatigue Behavior of SnAgCu Solder Joints

被引：0

作者：

Wang Chao ^{[1
]}

Zhu Yongxin ^{[1
]}

Li Xiaoyan ^{[1
]}

Gao Ruiting ^{[1
]}

机构：

[1] Beijing Univ Technol, Beijing 100124, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2016年 / 45卷 / 04期

关键词：

low cycle fatigue; lead-free solder joint; reliability; crack initiation; crack propagation; CU; MICROSTRUCTURE; IMC; BI;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Low cycle mechanical fatigue tests on 96.5Sn-3Ag-0.5Cu lead-free solder joints were carried out using a micro-uniaxial fatigue testing system at 25 degrees C with different frequencies (1 similar to 10 Hz) and a wide range of strain (2%similar to 8%). The results show that the low cycle fatigue (LCF) life of the solder joint follows the Coffin-Manson equation in different strain ranges. Frequency-modified Coffin-Manson equation can describe the frequency effect on the fatigue life of lead-free solder joints. The analysis of failure process show that the fatigue cracks initiate at the interfaces between the solder and inter-metallic compound (MC) around the edge of the joints, and then propagate within the solder along the solder/MC interfaces proximately. Fracture morphologies of solder joints under different frequencies mainly consist of an initiated region, a propagation region and a final fracture region. The fracture mechanism of the final fracture region transforms from inter-granular fracture to trans-granular fracture with increasing of frequency.

引用

页码：828 / 834

页数：7

共 17 条

[1] Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders [J].

Andersson, C ;

Lai, Z ;

Liu, J ;

Jiang, H ;

Yu, Y .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 394 (1-2) :20-27

[2] Computational modeling of the forward and reverse problems in instrumented sharp indentation [J].

Dao, M ;

Chollacoop, N ;

Van Vliet, KJ ;

Venkatesh, TA ;

Suresh, S .

ACTA MATERIALIA, 2001, 49 (19) :3899-3918

[3] Deformation behavior of (Cu, Ag)-Sn intermetallics by nanoindentation [J].

Deng, X ;

Chawla, N ;

Chawla, KK ;

Koopman, M .

ACTA MATERIALIA, 2004, 52 (14) :4291-4303

[4] Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag [J].

Kanchanomai, C ;

Miyashita, Y ;

Mutoh, Y ;

Mannan, SL .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 345 (1-2) :90-98

[5] Mechanical fatigue characteristics of Sn-3.5Ag-X (X = Bi, Cu, Zn and In) solder alloys [J].

Kariya, Y ;

Otsuka, M .

JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (11) :1229-1235

[6] Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints [J].

Lee, JG ;

Subramanian, KN .

JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (06) :523-530

[7] Damage produced in solder alloys during thermal cycling [J].

Liu, X. W. ;

Plumbridge, W. J. .

JOURNAL OF ELECTRONIC MATERIALS, 2007, 36 (09) :1111-1120

[8]

Manson S S, 1953, BEHAV MAT CONDITIONS, P76

[9] Thermal cycling test in Sn-Bi and Sn-Bi-Cu solder joints [J].

Miao, HW ;

Duh, JG ;

Chiou, BS .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2000, 11 (08) :609-618

[10] Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging [J].

Pang, HLJ ;

Tan, KH ;

Shi, XQ ;

Wang, ZP .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2001, 307 (1-2) :42-50

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