Phonon interference at self-assembled monolayer interfaces: Molecular dynamics simulations

被引:89
|
作者
Hu, Lin [1 ]
Zhang, Lifa [2 ,3 ]
Hu, Ming [4 ]
Wang, Jian-Sheng [2 ,3 ]
Li, Baowen [2 ,3 ,5 ]
Keblinski, Pawel [1 ]
机构
[1] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA
[2] Natl Univ Singapore, Dept Phys, Singapore 117542, Singapore
[3] Natl Univ Singapore, Ctr Computat Sci & Engn, Singapore 117542, Singapore
[4] ETH, Inst Energy Technol, Dept Mech & Proc Engn, CH-8092 Zurich, Switzerland
[5] NUS, Grad Sch Integrat Sci & Engn, Singapore 117456, Singapore
关键词
CONDUCTANCE;
D O I
10.1103/PhysRevB.81.235427
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Using molecular dynamics simulations, we expose phonon interference effects in thermal transports across a self-assembled monolayer (SAM) of alkanethiol molecules covalently bonded to (111) gold substrate and physically bonded to silicon. In particular, we show that the thermal conductance of SAM-Au interface depends on the bonding strength at the SAM-Si interface and that the phonon transmission coefficients show strong and oscillatory dependence on frequency, with oscillatory features diminishing with increasing SAM thickness. To explore the generality of this behavior we analyze a simple model of point junction on a one-dimensional chain using the scattering boundary method.
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页数:5
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