Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

被引：82

作者：

Juang, Jing-Ye ^{[1
]}

Lu, Chia-Ling ^{[1
]}

Chen, Kuan-Ju ^{[1
]}

Chen, Chao-Chang A. ^{[3
]}

Hsu, Po-Ning ^{[1
]}

Chen, Chih ^{[1
]}

Tu, K. N. ^{[1
,2
]}

机构：

[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30010, Taiwan

[2] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

[3] Natl Taiwan Univ Sci & Technol, Dept Mech Engn, Taipei 10607, Taiwan

来源：

SCIENTIFIC REPORTS | 2018年 / 8卷

关键词：

TEMPERATURE; CREEP;

D O I：

10.1038/s41598-018-32280-x

中图分类号：

O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];

学科分类号：

07 ; 0710 ; 09 ;

摘要：

A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 degrees C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, further annealing in the temperature gradient, as well as in a reversed temperature gradient, was performed. They showed similar recrystallization behavior with de-twinning. To analyze the de-twinning, we recall the classic model of annealing twin formation by Fullman and Fisher as comparison. Our case is opposite to the model of Fullman and Fisher. A mechanism of direct bonding by surface diffusion creep is proposed.

引用

页数：11

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