Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints

被引：28

作者：

Liu, Yang ^{[1
]}

Zhang, Hao ^{[1
]}

Sun, Fenglian ^{[1
]}

机构：

[1] Harbin Univ Sci & Technol, Sch Mat Sci & Engn, Harbin 150040, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2016年 / 27卷 / 03期

基金：

中国国家自然科学基金;

关键词：

INTERMETALLIC COMPOUND GROWTH; LEAD-FREE SOLDERS; INTERFACIAL IMCS; COPPER SUBSTRATE; ZN ADDITION; EVOLUTION; ALLOYS; REFLOW; NANOPARTICLES; BEHAVIOR;

D O I：

10.1007/s10854-015-4016-x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The solderability of the Sn58Bi (SnBi)-nano Cu solder pastes and the microstructure of the solder joints were investigated. Experimental results indicated that the addition of the nano Cu particles in the SnBi solder paste shows limited effect on the solidus. The liquidus of the SnBi-3nano Cu solder paste was 1 degrees C higher than the SnBi solder paste. Solid Cu6Sn5 intermetallic particles formed in the SnBi-3nano Cu solder paste during the heating process. The Cu6Sn5 intermetallic particles decreased the mobility and wettability of the molten solder. Meanwhile, the Cu6Sn5 nano particles worked as nucleation sites for the formation of Bi grains and Sn-Bi eutectic phase during the cooling process and led to the grain refinement of the solder bulk. The SnBi-1nano Cu solder paste showed the smallest grain size in this research. Additionally, the SnBi-3nano Cu/Cu solder joint showed a eutectic microstructure of Sn-Bi system at the center of the solder bulk but a hypereutectic microstructure with polygon Bi grains near the margin in the solder bulk.

引用

页码：2235 / 2241

页数：7

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