Improvements in the device characteristics of amorphous indium gallium zinc oxide thin-film transistors by Ar plasma treatment

被引:303
作者
Park, Jin-Seong [1 ]
Jeong, Jae Kyeong
Mo, Yeon-Gon
Kim, Hye Dong
Kim, Sun-Il
机构
[1] Samsung SDI Co Ltd, Corp R&D Ctr, Gyeonggi Do 449902, South Korea
[2] Samsung Adv Inst Technol, Gyeonggi Do 449712, South Korea
关键词
D O I
10.1063/1.2753107
中图分类号
O59 [应用物理学];
学科分类号
摘要
The effect of Ar plasma treatment on amorphous indium gallium zinc oxide (a-IGZO) thin films was investigated. The net electron carrier concentration (10(20)-10(21) cm(-3)) of the a-IGZO thin films dramatically increased upon their exposure to the Ar plasma compared to that (10(14) cm(-3)) of the as-deposited thin film. The authors attempted to reduce the contact resistance between the Pt/Ti (source/drain electrode) and a-IGZO (channel) by using the Ar plasma treatment. Without the treatment, the a-IGZO thin film transistors (TFTs) with W/L=50/4 mu m exhibited a moderate field-effect mobility (mu(FE)) of 3.3 cm(2)/V s, subthreshold gate swing (S) of 0.25 V/decade, and I-on/off ratio of 4 x 10(7). The device performance of the a-IGZO TFTs was significantly improved by the Ar plasma treatment. As a result, an excellent S value of 0.19 V/decade and high I-on/off ratio of 1 x 10(8), as well as a high mu(FE) of 9.1 cm(2)/V s, were achieved for the treated a-IGZO TFTs. (c) 2007 American Institute of Physics.
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