Multilayer thick-film technology as applied to design of microwave devices

被引：2

作者：

Kapitanova, Polina V. ^{[1
]}

Simine, Alexander V. ^{[2
]}

Kholodnyak, Dmitry V. ^{[1
]}

Vendik, Irina B. ^{[1
]}

机构：

[1] St Petersburg Electrotech Univ, Dept Microelect & Radio Engn, St Petersburg 197376, Russia

[2] Innovat Ctr RF NXP Semicond, NL-6434 AE Nijmegen, Netherlands

来源：

JOURNAL OF THE EUROPEAN CERAMIC SOCIETY | 2007年 / 27卷 / 8-9期

关键词：

microwave integrated circuits (MICs);

D O I：

10.1016/j.jeurceramsoc.2006.11.019

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Possibilities of the sandwich multilayer technology to design microwave integrated circuits are discussed. Original designs of various passive microwave devices realized as multilayer sandwich structures are presented. Experimental results confirmed a good potential of the sandwich technology to design high-performance multilayer microwave integrated circuits. (c) 2006 Elsevier Ltd. All rights reserved.

引用

页码：2941 / 2944

页数：4

共 5 条

[1] CHERNYAKOV A, 2004, IEEE MTT S INT MICR, P559
[2] HEIDE P, 2003, P EUR WIR TECHN C MU, P359
[3] Kapitanova P, 2005, 35TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, P389
[4] Design of an LTCC switch diplexer front-end module for GSM/DCS/PCS applications
Lucero, R
Qutteneh, W
Pavio, A
Meyers, D
Estes, J
[J]. 2001 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2001, : 213 - 216
[5] Pinel S, 2002, IEEE MTT S INT MICR, P1553, DOI 10.1109/MWSYM.2002.1012152

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