Pulsed THz Imaging for Non-Destructive Testing of Adhesive Bonds

被引：0
|
作者：
Schmidhammer, U. [1 ]
Jeunesse, P. [1 ]
机构：
[1] Univ Paris 11, CNRS, UMR 8000, Chim Phys Lab,ELYSE, F-91405 Orsay, France
来源：
2014 39TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ) | 2014年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We demonstrate imaging with a single-shot THz Time Domain spectrometer for the rapid, but precise location and characterization of defects in an adhesive bond.
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收藏
页数：2
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