Microstructures and Properties of WC@W-Cu Composite Prepared by Composite Electroplating

W-Cu composites are widely used as materials for electronic packaging, electrodes, electrical contacts, and shells of artillery shells because of their low expansion coefficient, high strength, high electrical and thermal conductivity. The traditional preparation methods of W-Cu composite are difficult to take into account the densifiCation and the uniformity of the microstructure, resulting in insufficient electrical and thermal conductivity of the material, and it is difficult to meet the requirements of the modern electronics industry. Using W powder and WC@W powder obtained by carbonization of the surface of W powder as raw materials, W-Cu and WC@W-Cu composites were prepared by composite electroplating technology. The results show that the surface of W-Cu composite is rough and there are holes in the microstructure, while the WC@W-Cu composite has refined grains, and the microstructure is uniform and dense. The W content of WC@W-Cu composite is 43.6wt%, the HV hardness is 2050 MPa, the relative density is 99.3%, and the electrical conductivity can reach 54.6 MS/m. The WC@W-Cu composite not only increases the W content and significantly improves the hardness, but also is better than the W-Cu composite in relative density and conductivity.