Semiconductor superlattices have been extensively investigated for thermoelectric applications, to explore the effects of compositions, interface structures, and lattice strain environments on the reduction of thermal conductivity, and improvement of efficiency. Most studies assumed that the electronic properties of superlattices remain unaffected compared to those of their bulk counterparts. However, recent studies demonstrated that the electronic properties of silicon (Si)/germanium (Ge) superlattices show significant variations depending on compositions and growth substrates. These studies used a constant relaxation time approximation, and ignored the effects of electron scattering processes. Here, we consider electron scattering with phonons and ionized impurities, and report first-principles calculations of the electronic transport properties including the scattering rates. We investigate two classes of Si/Ge short-period superlattices: superlattices with varied compositions grown on identical substrates and with identical compositions but grown on different substrates. We illustrate the relationship between the energy bands of the superlattices and the electron-phonon relaxation times. We model the electron-ionized impurity interaction potentials by explicitly accounting for the in-plane and the cross-plane structural anisotropy of the configurations. Our analysis reveals that the inclusion of electron-phonon and electron-impurity scattering processes can lead to an similar to 1.56-fold improved peak power-factor of superlattices, compared to that of bulk Si. We observe that superlattices can also display dramatically reduced power-factors for certain lattice strain environments. Such reduction could cancel out potential thermoelectric efficiency improvements due to reduced thermal conductivities. Our study provides insight to predict the variation of electronic properties due to changes in lattice strain environments, essential for designing superlattices with optimized electronic properties.
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Donghua Univ, Inst Micro Nano Electromech Syst, Coll Mech Engn, Shanghai 201620, Peoples R ChinaShenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R China
Li, Shouhang
Tong, Zhen
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Shenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R ChinaShenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R China
Tong, Zhen
Shao, Cheng
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Univ Tokyo, Dept Mech Engn, Bunkyo Ku, Tokyo 1138656, JapanShenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R China
Shao, Cheng
Bao, Hua
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Shanghai Jiao Tong Univ, Univ Michigan Shanghai Jiao Tong Univ Joint Inst, Shanghai 200240, Peoples R ChinaShenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R China
Bao, Hua
Frauenheim, Thomas
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Shenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R China
Beijing Computat Sci Res Ctr, Beijing 100193, Peoples R China
Univ Bremen, Bremen Ctr Computat Mat Sci, D-2835 Bremen, GermanyShenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R China
Frauenheim, Thomas
Liu, Xiangjun
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Donghua Univ, Inst Micro Nano Electromech Syst, Coll Mech Engn, Shanghai 201620, Peoples R ChinaShenzhen JL Computat Sci & Appl Res Inst, Shenzhen 518131, Peoples R China
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Robert Bosch LLC, Res & Technol Ctr, Cambridge, MA 02139 USARobert Bosch LLC, Res & Technol Ctr, Cambridge, MA 02139 USA
Samsonidze, Georgy
Kozinsky, Boris
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Robert Bosch LLC, Res & Technol Ctr, Cambridge, MA 02139 USA
Harvard Univ, John A Paulson Sch Engn & Appl Sci, Cambridge, MA 02138 USARobert Bosch LLC, Res & Technol Ctr, Cambridge, MA 02139 USA