The Prospect of 3D-IC

被引：11

作者：

Wong, S. Simon ^{[1
]}

El Gamal, Abbas ^{[1
]}

机构：

[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA

来源：

PROCEEDINGS OF THE IEEE 2009 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 2009年

关键词：

D O I：

10.1109/CICC.2009.5280818

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper illustrates the performance advantages of 3D integrated circuits with two specific examples, namely 3D-FPGA and 3D-SRAM. Through strategic modification of the architectures to take advantage of 3D, significant improvement in speed and reduction in power consumption can be achieved.

引用

页码：445 / 448

页数：4

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