Dynamic Recrystallization of Cu-Cr-Ni-Si-Co Alloy During Hot Deformation

被引：5
作者：
Zhao, Zhilei [1 ]
Li, Zhou [1 ,2 ]
Xiao, Zhu [1 ,3 ]
Ma, Muzhi [1 ]
Song, Kerui [1 ]
机构：
[1] Cent South Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China
[2] Cent South Univ, State Key Lab Powder Met, Changsha 410083, Peoples R China
[3] Minist Educ, Key Lab Nonferrous Met Mat Sci & Engn, Changsha 410083, Peoples R China
来源：
JOM | 2021年 / 73卷 / 08期
基金：
中国国家自然科学基金;
关键词：
PROCESSING MAPS; HIGH-STRENGTH; MICROSTRUCTURE EVOLUTION; ALUMINUM-ALLOY; FLOW-STRESS; ZN ALLOYS; ZR ALLOY; BEHAVIOR; WORKING; COMPRESSION;
D O I：
10.1007/s11837-021-04731-w
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Hot compression deformation behavior of the Cu-0.45Cr-1.0Ni-0.28Si-0.14Co alloy was studied by a thermal-mechanical simulator at strain rates of 0.001-1 s(-1) and deformation temperatures of 700-900 degrees C. The microstructure and texture of the copper alloy after the hot compression deformation were investigated. The results showed that the flow behavior of the Cu-Cr-Ni-Si-Co alloy was significantly affected by the deformation temperature and strain rate. The typical dynamic recrystallization (DRX) occurred at high temperatures and low strain rates, while the typical dynamic recovery (DRV) appeared at low temperatures and high strain rates. When the deformation temperature increased from 700 degrees C to 900 degrees C, a transition from copper and S texture to gross texture was found. The value of hot deformation activation energy (Q) was calculated as 330.87 kJ/mol. The optimized hot deformation parameters for the Cu-Cr-Ni-Si-Co alloy were 800-850 degrees C/0.01-0.1 s(-1).
引用
收藏
页码：2274 / 2284
页数：11
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