Curing mechanism of TDE-85/MeTHPA epoxy resin modified by polyurethane

被引:4
|
作者
Li Zhi-hua [1 ]
Zheng Zi-qiao
Ren Dong-yan
Huang Yao-peng
机构
[1] Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China
[2] Mianyang Vocat & Tech Coll, Dept Mat Engn, Mianyang 621000, Peoples R China
来源
关键词
polyuretbane; epoxy resin; modification; curing mechanism; INTERPENETRATING POLYMER NETWORKS; PHASE-SEPARATION; KINETICS;
D O I
10.1007/s11771-007-0058-4
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Diglycidyl 4,5-epoxy tetrahydro phthalate/methyl tetrahydrophthalic anhydride (TDE-85/MeTHPA) epoxy resin modified by polyurethane (PU) was prepared with 1,4-butanediol (1,4-BDO), trimethylol propane (TMP) and polyurethane prepolymer synthesized by polypropylene glycol and toluene diisocynate. Chemical reaction and curing mechanism of this system were discussed by incorporating the results of infra spectrum analysis. The results indicate that the epoxy polymeric network I is obtained by the curing reaction between TDE-85 and MeTHPA, while the PU polymeric network 11 is obtained by the chain-extended and crosslinking reaction between 1,4-BDO, TMP and polyurethane prepolymer(PUP). The graft chemical bonds are formed between polymer networks I and 11 that therefore increase the degree of blend and compatibility between epoxy polymer and PU.
引用
收藏
页码:296 / 300
页数:5
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