[1] ETH Zurich, Phys Elect Lab, CH-8093 Zurich, Switzerland
来源:
INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST
|
1997年
关键词:
D O I:
10.1109/IEDM.1997.650525
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
For the first time a packaged single-chip anemometry microsystem is reported. The system includes a thermal CMOS flow sensor with on-chip power management, signal conditioning, and A/D conversion. It is fabricated using an industrial IC process followed by post-CMOS micromachining. The system is packaged on a flexible substrate using flip-chip interconnection technology. The measurement of wind speeds is demonstrated in the range from 0 to 38 m/s (0 to 12 Beaufort), with a dynamic range of 65 dB. Total power consumption is 3 mW.