Dynamical growth behavior of copper clusters during electrodeposition

被引：14

作者：

Hsu, Pei-Cheng ^{[1
]}

Chu, Yong ^{[2
]}

Yi, Jae-Mock ^{[2
]}

Wang, Cheng-Liang ^{[1
]}

Wu, Syue-Ren ^{[1
,3
]}

Hwu, Y. ^{[1
,3
,4
]}

Margaritondo, G. ^{[5
]}

机构：

[1] Acad Sinica, Inst Phys, Taipei 115, Taiwan

[2] Argonne Natl Lab, Adv Photon Source, Argonne, IL 60439 USA

[3] Natl Tsing Hua Univ, Dept Engn Sci & Syst, Hsinchu 300, Taiwan

[4] Natl Ocean Univ, Inst Optoelect Sci, Chilung 202, Taiwan

[5] Ecole Polytech Fed Lausanne, CH-1015 Lausanne, Switzerland

来源：

APPLIED PHYSICS LETTERS | 2010年 / 97卷 / 03期

关键词：

copper; electrodeposition; metal clusters; particle size; surface morphology; X-ray microscopy; SCANNING-TUNNELING-MICROSCOPY; ELECTROCHEMICAL NUCLEATION; BARRIER LAYERS; CU; DEPOSITION; GOLD; ELECTROLYTES; AU(111); AU(100); FILMS;

D O I：

10.1063/1.3464550

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Ultrahigh resolution full-field transmission x-ray microscopy enabled us to observe detailed phenomena during the potentiostatic copper electrodeposition on polycrystalline gold. We detected two coexisting cluster populations with different sizes. Their growth behaviors are different, with a shape transitions only occurring for large clusters. These differences influence the micromorphology and general properties of the overlayer. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3464550]

引用

页数：3

共 26 条

[1] GROWTH OF A COPPER-GOLD ALLOY PHASE BY BULK COPPER ELECTRODEPOSITION ON GOLD INVESTIGATED BY IN-SITU STM [J].